
1. Responsible for OSA, design key processes such as die bonding and dispensing for high-speed B0X and other optical devices in the new project phase, plan orthogonal experiments to validate and finalize robust processes.
2. Responsible for OSA, high-speed of 400G and 800G optical devices and optical engine samples; And corresponding key process new platform evacuation, validation, and import.
1. Bachelor's degree or above in related majors such as optoelectronics, electronics, materials, machinery, and communication
2. More than 3 years of work experience, familiar with the process of optical device reflow.
3. Have a good understanding and experience in the packaging process of optical devices such as surface mount and adhesive bonding.
4.Understand mainstream devices in the market such as Heller/Tamura etc. And be familiar with the basic principles of equipment and have certain practical skills in equipment program programming or process development.