
About Our Group:
Our team at the Seagate Korat Slider Factory focuses on high-precision mechanical process engineering for the next generation of data storage products. We are seeking an engineer to lead the development and optimization of lapping and surface finishing processes for new, miniaturized form factor substrates. This role is critical to achieving ultra-high precision dimensional control and superior surface quality required by advanced magnetic recording heads.
About the Role – You Will:
• Develop end-to-end process strategies for lapping of small form factor substrates, ensuring dimensional accuracy, consistency and high surface finished quality.
• Optimize lapping plate conditioning and preparation, including abrasive particle embedding, plate surface texture control, and refresh cycles, tailored for reduced substrate size and enhanced edge performance.
• Improve key lapping parameters, such as applied pressure, rotation speed profiles, carrier design, and lubricant delivery systems to reduce variation and mechanical stress on fragile substrates.
• Enhance control logic and automation routines for the lapping system, collaborating with software and automation teams to update and tune the Windows-based C++ control interface to better respond to form factor-specific needs.
• Analyze process performance data, identify yield or quality gaps, and lead in-depth root cause investigations to drive corrective and preventive actions.
• Ensure thorough documentation of process flows, control plans, work instructions, and engineering change management.
About You:
• Bachelor’s or Higher degree in Electrical, Mechanical, Chemical Engineering or Computer Science background is preferred.
• Strong understanding of lapping, polishing, or surface finishing processes, ideally within precision or semiconductor-grade manufacturing.
• Proficient in data analysis using tools like JMP, Python, or Excel, and skilled in DOE methodologies.
• Basic understanding of C++/automation system control logic and how it interfaces with mechanical tooling is a strong advantage.
• Strong analytical and problem-solving mindset with the ability to drive cross-functional alignment and execution.
• Effective communicator in both written and verbal English, with the ability to present findings clearly across technical and management teams.
Preferred Experience:
• Experience in lapping or CMP (Chemical Mechanical Polishing) of micro-scale components.
• Exposure to adaptive process control systems and digital twin modeling.