

1. Male
2. Age 35 years old Upward.
3. Bachelor’s degree in Mechanical Engineering / Electronic Engineering.
4. Have experience at least 5 years about Maintenance Management for Semiconductor manufacturing.
5. Have knowledge about ICS packaging at Dicing, Die Bond and Wire Bonding Process .
6.Experienced in machine maintenance for Dicing, Die Bonding and Wire Bonding Machine.
7.Experienced in defects analysis and quality improvement.
8.Knowledge in TS 16949 and Environmental Management System.