
1. Responsible for OSA, design key processes such as die bonding and dispensing for high-speed 80x and other optical devices in the new project phase, plan orthogonal experiments to validate and finalize robust processes.
2. Responsible for OSA, high-speed of 400G and 800G optical devices and optical engine samples, And corresponding key process new platform evaluation, validation, and import.
1. Bachelor's degree or above in related majors such as optoelectronics, electronics, materials, machinery, and communication.
2. More than 3 years of work experience, familiar with the process flow of optical device epoxy dispensing.
3. Have a good understanding and experience in the packaging process of optical devices such as surace mount and adhesive bonding.
4. Be familiar with the basic principles of equipment and have certain practical skills in equipment program programming or process development.
5. Strong learning ability, possessing certain analytical and problem-solving skills, and clear logical thinking.
6. Have a solid foundation in optoelectronics and possess certain English communication and reading abilities.
7. Good teamwork spirit, sense of responsibility and patience, rigorous and meticulous, and proactive in work.